Method of protecting front surface structure of wafer and method of wafer dividing
OwnerChih-Hsien Cheninventor
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Abstract
A method of protecting front surface structure of a wafer and method of wafer dividing is provided. Initially, a wafer having a plurality of device disposed on a front surface thereof is provided. A protective layer is formed on the front surface of the wafer and a first bonding layer is provided to bond the wafer to a carrier. Subsequently, a wafer dividing process is performed to form a plurality of dies. After that, the first bonding layer and the protective layer are removed to separate the dies individually.
Claims12
A method of protecting a front surface structure, comprising:
- providing a wafer having a plurality of devices disposed on a front surface thereof;
- forming a protective layer covering the front surface;
- providing a first bonding layer and attaching the first bonding layer to the protective layer to bond the wafer to a carrier;
- performing a wafer dividing process on a back surface of the wafer to form a plurality of dies;
- and
- removing the first bonding layer and the protective layer.
A method of protecting a front surface structure and wafer dividing, comprising:
- providing a wafer having a plurality of devices on a front surface thereof;
- forming a water-soluble protective layer on the front surface of the wafer;
- providing a first bonding layer and attaching the first bonding layer to the protective layer to bond the wafer to a carrier;
- performing a wafer dividing process to segment the wafer from a back surface of the wafer and separate each device to form a plurality of dies;
- providing a second bonding layer and attaching the second bonding layer to the back surface of the dies and reversing the dies;
- removing the water-soluble protective layer and the first bonding layer;
- and
- removing the second bonding layer to separate the dies.
Dependencies are inferred from the claim text.