Method of fabricating micro mechanical moving member and metal interconnects thereof

A method of fabricating micro mechanical moving member and metal interconnects thereof, comprising:

• providing a substrate;
• forming a first sacrificial pattern having a plurality of first openings on the substrate;
• performing a first plating process to form a first metal interconnect pattern in each of the first openings;
• removing the first sacrificial pattern, and forming a second sacrificial pattern on the substrate and on the first metal interconnect pattern, the second sacrificial pattern having a plurality of second openings partially exposing the first metal interconnect pattern;
• performing a second plating process to form a second metal interconnect pattern in each of the second openings;
• removing the second sacrificial pattern;
• forming an inter-metal dielectric layer on the substrate, the first metal interconnect pattern and the second metal interconnect pattern;
• planarizing the surface of the inter-metal dielectric layer to expose the second metal interconnect pattern;
• and
• forming at least one micro mechanical moving member, which electrically connects to the second metal interconnect pattern, on the inter-metal dielectric layer by plating techniques.