Method of sorting dies using discrimination region
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung-Dae Kim, Yun-Ki Kim, Sung-Un Bae
Life of this patent
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Abstract
A method of sorting dies using a discrimination region includes preparing a wafer including a chip region in which a plurality of dies are disposed and an edge region in which at least one discrimination region is disposed; testing the dies to prepare a wafer map for defining the coordinates of good dies and bad dies; allowing dies defined by the wafer map to correspond to the dies of the wafer; and confirming the correctness of the correspondence between the wafer and the wafer map by checking whether the discrimination region is included in the dies defined by the wafer map.
Claims12
A method of sorting dies comprising:
- preparing a wafer including a chip region in which a plurality of dies are disposed and an edge region in which at least one discrimination region is disposed;
- testing the dies to prepare a wafer map for defining the coordinates of good dies and bad dies;
- allowing dies defined by the wafer map to correspond to the dies of the wafer;
- and
- confirming the correctness of the correspondence between the wafer and the wafer map by determining whether the discrimination region is included in the dies defined by the wafer map.
Dependencies are inferred from the claim text.