Radiation-Sensitive Resin Composition
OwnerIsao Nishimura, Takashi Chiba +1inventors
InventorsIsao Nishimura, Takashi Chiba, Tsutomu Shimokawa
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OwnerIsao Nishimura, Takashi Chiba +1inventors
InventorsIsao Nishimura, Takashi Chiba, Tsutomu Shimokawa
Estimating the term…
A radiation-sensitive resin composition exhibiting only extremely controlled change in the sensitivity after storage when used as a chemically-amplified resist possessing high transparency at a wavelength of 193 nm or less and particularly excellent depth of focus (DOF) is provided. The radiation-sensitive resin composition comprises (A) a siloxane resin having a structural unit (I) shown by the following formula (I) and/or a structural unit (II) shown by the following formula (II), (B) a photoacid generator, and (C) a solvent, the content of nitrogen-containing compounds in the composition being not more than 100 ppm, wherein A and B individually represent a substituted or unsubstituted divalent linear, branched, or cyclic hydrocarbon group, R1 represents a monovalent acid-dissociable group, and R2 represents a hydrogen atom or monovalent acid-dissociable group.
A radiation-sensitive resin composition comprising (A) a siloxane resin having a structural unit (I) shown by the following formula (I) and/or a structural unit (II) shown by the following formula (II), (B) a photoacid generator, and (C) a solvent, the content of nitrogen-containing compounds other than the components (A) to (C) in the composition being not more than 100 ppm,
A radiation-sensitive resin composition comprising (A) a siloxane resin having a structural unit (I) shown by the following formula (I) and/or a structural unit (II) shown by the following formula (II) and a structural unit (III) shown by the following formula (III), (B) a photoacid generator, and (C) a solvent, the content of nitrogen-containing compounds other than the components (A) to (C) in the composition being not more than 100 ppm,
Dependencies are inferred from the claim text.