Vacuum molding apparatus
AssigneeAsm Technology Singapore Pte Ltd
InventorsZheng Yu GAO, Shu Chuen HO
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Abstract
A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.
Claims5
A molding apparatus for molding a leadframe, comprising:
- a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area;
- at least one molding cavity located in the leadframe-receiving area;
- a plurality of vacuum suction holes formed adjacent to the molding cavity and located within the leadframe-receiving area, the vacuum suction holes being operative to evacuate air from the mold surface;
- and
- air vents connecting the vacuum suction holes to the molding cavity.
Dependencies are inferred from the claim text.