US 2008/0187453 A1Published application

Material mixture, sputter target and method for producing a sputter target

AssigneeW.C. Heraeus GmbH

InventorsMarkus SCHULTHEIS, Martin Weigert

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Abstract

A material mixture is produced having a cobalt-based alloy as the predominant component and an additional component of at least TiOx. The material mixture may be formed into a sputter target by hot pressing.

Claims10

Dependent claims

A material mixture comprising a cobalt-based alloy as a predominant component and a component of lesser amount comprising at least TiOx, wherein x is the atomic ratio of O to Ti.

Dependencies are inferred from the claim text.

Facts

Application: 12/101,544Filed 11 Apr 2008
Priority: DE 10 205 049 328.912 Oct 2005
Published: 7 Aug 2008
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

C23C 14/3414
Cathode assembly for sputtering apparatus, e.g. Target: metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
C22C 32/0026
With only single oxides as main non-metallic constituents: matrix based on Ni, Co, Cr or alloys thereof
B22F 2998/10
Supplementary information concerning processes or compositions relating to powder metallurgy: processes characterised by the sequence of their steps
C23C
Coating metallic material

Family

Application12/101,544Continuation
US 2008/0187453 A1This patent

From the US filing history. Foreign family members aren’t listed.

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