Semiconductor package
AssigneeHynix Semiconductor Inc.
InventorShin Ho Chu
Life of this patent
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Abstract
A semiconductor package facilitates package connection due to different locations of input/output pads in each interlayer die depending on coding information in a multi-chip package. The semiconductor package includes many chips. Each of the chips includes: input/output pads configured to input and output data having a given bandwidth; a decoding pad configured to receive coding information; and a code control unit configured to decode the coding information and to enable an input/output pad positioned at a specific location among the input/output pads according to the decoding result.
Claims14
A semiconductor package including a plurality of chips, wherein each of the chips include:
- input/output pads configured to input and output data at a given bandwidth;
- a decoding pad configured to receive coding information;
- and
- a code control unit configured to decode the coding information to obtain a decoding result, and to enable an input/output pad positioned at a specific location among the input/output pads according to the decoding result.
Dependencies are inferred from the claim text.