Semiconductor device and method

A semiconductor device, comprising:

• a semiconductor wafer having first and second opposing sides;
• a active area formed on a first portion of the first side having a topology extending a first distance above the first side;
• and
• first means for adjusting a topology of a second portion of the first side.

A method of producing a semiconductor device, comprising:

• providing a generally circular semiconductor wafer having an active area formed on a central portion of a first side of the wafer, the active area having a topology extending a first distance above the first side and forming an edge exclusion area about the periphery of the wafer;
• dispensing an adhesive around the edge exclusion area;
• attaching the first side to a chuck;
• and
• spinning the wafer to remove excess adhesive.