Dual stress liner
AssigneeInternational Business Machines Corporation
InventorsXiangdong Chen, Haining S. Yang
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorsXiangdong Chen, Haining S. Yang
Estimating the term…
A semiconductor device structure is provided which includes a first field effect transistor (“FET”) having a first channel region, a first source region, a first drain region and a first gate conductor overlying the first channel region. A second FET is included which has a second channel region, a second source region, a second drain region and a second gate conductor overlying the second channel region. The first and second gate conductors can be portions of a single elongated conductive member extending over both the first and second channel regions. A first stressed film may overlie the first FET and the first stressed film may apply a stress having a first value to the first channel region. A second stressed film may overlie the second FET and the second stressed film may apply a stress having a second value to the second channel region. The second value is substantially different from the first value. The first and second stressed films can abut each other at a common boundary and present a substantially co-planar major surface at the common boundary.
A semiconductor device structure, comprising:
Dependencies are inferred from the claim text.