Process for reflow soldering
AssigneeSEHO Systemtechnik GmbH
InventorsRolf Ludwig Diehm, Markus Walter, Horst Lettner
Life of this patent
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Abstract
The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in the chamber is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature.
Claims8
Process for the reflow soldering of printed circuit board assemblies (15) provided with solder paste in a sealed chamber with heating in the chamber (19), characterized in that, in a first process step, the pressure in the chamber (19) is amplified in comparison with the atmospheric pressure and the temperature in the chamber (19) is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature.
Dependencies are inferred from the claim text.