Reduced friction molds for injection molded solder processing
AssigneeInternational Business Machines Corporation
InventorMark D. Schultz
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Abstract
A process of reducing friction, which is encountered in molds utilized in injection molded, solder processing, and wherein glass mold plates have mold pits etched therein. The mold pates are subjected to a heat treatment so as to smooth or round-off sharp edges along the periphery of the mold pits.
Claims31
A method of modifying mold plates having mold pits etched in the upper surfaces of said mold plates, said mold plates being utilized in implementing injection molded solder processing, said method comprising:
- smoothing the peripheral edges of each of said mold pits from an initially sharp condition into a rounded-off or smoothly radiused configuration.
A mold plate having mold pits etched in an upper surface thereof, wherein said molt plate is utilized in injection molded processing, wherein said mold plate is subjected in at least the upper surface regions thereof to a heat treatment so as to cause an initially sharp peripheral edge of each of said mold pits to deform into a rounded-off or smoothly radiused configuration extending into said upper surface of the mold plate.
Dependencies are inferred from the claim text.