Semiconductor device fabrication method and semiconductor device
AssigneeElpida Memory, Inc.
InventorsTomohiro Uno, Yoshitaka Nakamura
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AssigneeElpida Memory, Inc.
InventorsTomohiro Uno, Yoshitaka Nakamura
Estimating the term…
A method for fabricating a semiconductor device is disclosed. The semiconductor device includes a capacitor and a support insulator. The capacitor includes a cylindrical electrode. The cylindrical electrode comprises upper and lower sections. The lower section has a roughened inner surface and an outer surface supported by the support insulator. The upper section upwardly projects from the support insulator. An initial cylindrical electrode is formed, wherein the initial cylindrical electrode comprises an initial upper section and an initial lower section which correspond to the upper section and the lower section of the cylindrical electrode, respectively. The initial upper section is supported by the support insulator. Specific impurities are implanted into the initial upper section, wherein the specific impurities serve to prevent the initial upper section from being roughened. Then, the initial cylindrical electrode is exposed to a roughening process so that the initial lower section is roughened to be the lower section.
A method for fabricating a semiconductor device, the semiconductor device including a capacitor and a support insulator, the capacitor including a cylindrical electrode, the cylindrical electrode extending in a vertical direction,
A semiconductor device including a capacitor and a support insulator, the capacitor including a cylindrical electrode, the cylindrical electrode comprising upper and lower sections, the lower section having an outer surface supported by the support insulator and a roughened inner surface, the upper section upwardly projecting from the support insulator and having an inner surface that is not substantially roughened.
Dependencies are inferred from the claim text.