Method of forming image contour for predicting semiconductor device pattern
AssigneeSamsung Electronics Co., Ltd.
InventorsYong-jin Chun, Doo-youl Lee, Moon-hyun Yoo, Suk-joo Lee
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AssigneeSamsung Electronics Co., Ltd.
InventorsYong-jin Chun, Doo-youl Lee, Moon-hyun Yoo, Suk-joo Lee
Estimating the term…
A method of forming an image contour for predicting a pattern image formed on a wafer from a layout of a semiconductor device includes: forming a basic layout for a semiconductor device; performing an optical proximity effect correction (OPC) on the basic layout to form an OPC layout; defining nonlinear regions and linear regions of the basic layout; emulating the nonlinear regions of the basic layout using the OPC layout to form an image contour of the nonlinear regions; determining the linear regions of the basic layout as an image contour of the linear regions; and combining the image contour of the nonlinear regions and image contour of the linear regions to form an image contour of the entire semiconductor device.
A method of forming an image contour, comprising:
A method of forming an image contour for predicting a semiconductor pattern formed using an SADP (self aligned double patterning) process comprising
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