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AssigneeInternational Business Machines Corporation
InventorsDouglas Coolbaugh, Hanyi Ding, Ebenezer Eshun, Michael Gordon, Zhong-Xiang He, Anthony Stamper
Estimating the term…
A parallel plate capacitor formed in the back end of an integrated circuit employs conductive capacitor plates that are formed simultaneously with the other interconnects on that level of the back end (having the same material, thickness, etc). The capacitor plates are set into the interlevel dielectric using the same process as the other interconnects on that level of the back end (preferably dual damascene). Some versions of the capacitors have perforations in the plates and vertical conductive members connecting all plates of the same polarity, thereby increasing reliability, saving space and increasing the capacitive density compared with solid plates.
A parallel plate capacitor for use in an integrated circuit comprising a set of capacitor plates disposed on consecutive levels in the back end of an integrated circuit, alternate ones of the capacitor plates overlapping with vertically adjacent capacitor plates and being adapted to connect to electrical sources of opposite polarity, thereby forming a first set of a first polarity and a second set of a second polarity, said capacitor plates being formed simultaneously with other interconnections in the remaining portion of the integrated circuit;
(canceled)
A method of forming a parallel plate capacitor comprising a set of capacitor plates disposed on consecutive levels in the back end of an integrated circuit, alternate ones of the capacitor plates overlapping with vertically adjacent capacitor plates and being adapted to connect to electrical sources of opposite polarity, thereby forming a first set of plates of a first polarity and a second set of plates of a second polarity, comprising the steps of:
Dependencies are inferred from the claim text.