Method for producing semiconductor chip
AssigneeDisco Corporation
InventorToshiyuki Yoshikawa
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AssigneeDisco Corporation
InventorToshiyuki Yoshikawa
Estimating the term…
A method for producing many semiconductor chips, each having a semiconductor circuit disposed on the face thereof and a die bonding film stuck to the back thereof, from a semiconductor wafer in which many rectangular regions are defined on its face by streets arranged in a lattice pattern, and the semiconductor circuit is disposed in each of the rectangular regions. The method comprises: a groove formation step of forming grooves of a predetermined depth along the streets on the face of the semiconductor wafer; a protective film sticking step of sticking a protective film to the face of the semiconductor wafer, where the grooves have been formed; a division step of grinding the back of the semiconductor wafer to render the thickness of the semiconductor wafer equal to or smaller than the depth of the groove, thereby dividing the rectangular regions individually; a die bonding film/holding film sticking step of sticking a die bonding film and a holding film, in this order, to the ground back of the semiconductor wafer; a protective film peeling step of peeling the protective film from the face of the semiconductor wafer; a spacing increasing step of stretching the holding film to increase spacing between the individually divided rectangular regions; and a die bonding film cutting step of irradiating the die bonding film with a laser beam from the face side of the semiconductor wafer through the clearance between the rectangular regions to cut the die bonding film along the clearance between the rectangular regions.
A computer implemented method for an analysis of a plurality of software components prior to deployment, comprising:
(canceled)
The method of claim 9, further comprising providing a user with a plurality of options if the tenth plurality of dependent remaining components is identified.
A system for an analysis of a plurality of software components to be conducted before installing the plurality of software components, comprising:
(canceled)
A data structure encoded in a computer readable media and associated with a software component installation package adapted for execution on a computer, the data structure adapted for identifying a third plurality of potential conflicts between a second plurality of components to be installed on a system and a first plurality of components previously installed on the system, comprising:
A computer program product of a computer-readable medium usable with a programmable computer, the computer program product having computer-readable code embodied therein for pre-deployment analysis of software components, the computer-readable code comprising instructions for:
(canceled)
A method for installing a plurality of software components based upon a preinstallation analysis, comprising:
Dependencies are inferred from the claim text.