Integrated circuit capacitor structure
AssigneeSamsung Electronics Co., Ltd.
InventorsKyoung-woo Lee, Wan-jae Park, Jeong-hoon Ahn, Kyung-tae Lee, Mu-kyeng Jung, Yong-jun Lee, Il-goo Kim, Soo-geun Lee
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AssigneeSamsung Electronics Co., Ltd.
InventorsKyoung-woo Lee, Wan-jae Park, Jeong-hoon Ahn, Kyung-tae Lee, Mu-kyeng Jung, Yong-jun Lee, Il-goo Kim, Soo-geun Lee
Estimating the term…
Embodiments of the invention include a MIM capacitor that has a high capacitance that can be manufactured without the problems that affected the prior art. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate the upper and the lower electrodes. A first voltage can be applied to the upper electrode and a second voltage, which is different from the first voltage, can be applied to the lower electrode. A wire layer, through which the first voltage is applied to the upper electrode, is located in the same level as or in a lower level than the lower electrode.
A method of forming an MIM capacitor, comprising:
A method of forming an MIM capacitor, comprising:
Dependencies are inferred from the claim text.