Back to results
US 2007/0176241 A1Published application
Semiconductor chips having improved electrostatic discharge protection circuit arrangement
AssigneeSamsung Electronics Co., Ltd.
InventorsKi-Tae Lee, Han-Gu Kim, Jae-Hyok Ko
Life of this patent
Estimating the term…
Abstract
A semiconductor chip may include a plurality of pads arranged in at least a first and a second row, and a plurality of protection circuits connected to the plurality of pads. The plurality of protection circuits may include at least one diode. A first protection circuit may be connected to a first pad in the first row of pads, and a second protection circuit may be connected to a second pad in the second row of pads. The first and second protection circuits may be arranged under the first row of pads.
Claims20
A semiconductor device comprising:
- a plurality of pads arranged in at least a first row and a second row, the plurality of pads including at least a first pad formed in the first row on an outer portion of a semiconductor chip and at least a second pad formed in the second row on an inner portion of a semiconductor chip;
- and
- a plurality of protection circuits connected to the plurality of pads, the plurality of protection circuits including at least a first protection circuit connected to the first pad and a second protection circuit connected to a second pad, the first and second protection circuits being arranged under the first row of pads.
Dependencies are inferred from the claim text.