Carrier, holder, laser cutting device and method for separating semiconductor products using laser light
OwnerHenri Van Egmond, Joannes Zijl +1inventors
InventorsHenri Van Egmond, Joannes Zijl, Marcel Rensen
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Abstract
The invention relates to a carrier and to a holder for supporting and engaging semiconductor products during separating of the products using laser light. The invention also relates to a method for supporting and engaging semiconductor products during separating of the products using laser light.
Claims13
1-12. (canceled)
A carrier for supporting and engaging semiconductor products during separating of the products using laser light, wherein the carrier comprises a plate provided with a pattern of holes arranged in a flat carrying side of the plate, and that the plate is manufactured from a material at least substantially not absorbing the laser light.
A method for supporting and engaging semiconductor products during separating of the products using laser light, comprising the processing steps of:
- A) placing an assembly of semiconductor products for separating onto a flat plate provided with a pattern of holes, B) applying an underpressure to the holes of the pattern of holes such that the assembly of semiconductor products is drawn against the plate, C) directing at least one laser beam onto the assembly and cutting through the assembly where this is desired by means of mutual displacement of the laser source and the flat plate such that each severed semiconductor product is still connected to at least one hole in the flat plate, and D) taking the separated products from the plate.
Dependencies are inferred from the claim text.