Chemical and mechanical polishing method and polishing liquid using therefor
AssigneeFuji Photo Film Co., Ltd.
InventorTomohiko Akatsuka
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Abstract
A polishing method comprising chemically and mechanically polishing a surface to be polished, the polishing comprising a plurality of steps, wherein the surface is polished with a polishing liquid containing an oxidant in each of the plurality of steps, and the polishing liquids used for the each of the steps are different only in a concentration of the oxidant and satisfy the following expression (1): Rn-1>Rn (1), wherein Rn represents a polishing rate of the surface to be polished in nth step, Rn-1 represents a polishing rate of the surface to be polished in n−1th step, and n represents an integer of 2 or more.
Claims7
A polishing method comprising chemically and mechanically polishing a surface to be polished, the polishing comprising a plurality of steps, wherein the surface is polished with a polishing liquid containing an oxidant in each of the plurality of steps, and the polishing liquids used for the each of the steps are different only in a concentration of the oxidant and satisfy the following expression (1):
- Rn-1>Rn (1)
- wherein Rn represents a polishing rate of the surface to be polished in nth step, Rn-1 represents a polishing rate of the surface to be polished in n−1th step, and n represents an integer of 2 or more.
Dependencies are inferred from the claim text.