Slurry composition, method of polishing an object and method of forming a contact in a semiconductor device using the slurry composition
OwnerKi-Hoon Jang, Yong-Sun Ko +1inventors
InventorsKi-Hoon Jang, Yong-Sun Ko, Kyung-Hyun Kim
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Abstract
In a slurry composition preventing damage to an insulation layer, and uniformly polishing a metal layer, the slurry composition includes an acidic aqueous solution having a first pH and an anionic surfactant having a second pH lower than or equal to the first pH. Irregular polishing of the metal layer relative to a pattern density may be prevented and a contact having a uniform thickness may be formed using the slurry composition.
Claims35
A slurry composition comprising:
- an acidic aqueous solution having a first pH;
- and
- an anionic surfactant having a second pH lower than or equal to the first pH.
A slurry composition comprising:
- an acidic aqueous solution including an oxidizing agent, an abrasive and water, the acidic aqueous solution having a first pH;
- and
- an anionic surfactant having a second pH lower than or equal to the first pH.
A method of polishing an object comprising:
- preparing an object;
- introducing a slurry composition to a polishing pad, the slurry composition including an acidic aqueous solution having a first pH and an anionic surfactant having a second pH lower than or equal to the first pH;
- and
- polishing a surface of the object by contacting the polishing pad and the surface of the object.
A method of forming a contact in a semiconductor device comprises:
- providing a substrate;
- forming an insulation layer on said substrate, said substrate including a lower structure;
- partially removing the insulation layer to form a contact hole exposing a portion of the lower structure;
- forming a conductive layer on the insulation layer which fills the contact hole;
- and
- chemically and mechanically polishing the conductive layer with a slurry composition including an acidic aqueous solution having a first pH, and an anionic surfactant having a second pH lower than or equal to the first pH, until an upper surface of the insulation layer is exposed.
Dependencies are inferred from the claim text.