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US 2006/0141913 A1Published application
Wafer planarization composition and method of use
Assignee3M Innovative Properties Company
InventorsChristopher Rueb, Richard Webb, Bhaskar Velamakanni
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Abstract
A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
Claims10
A working liquid for chemical mechanical planarization of a wafer comprising:
- at least one amino acid selected from the group consisting of proline and histidine;
- cations having a cation concentration of at least about 0.0001 molar, wherein said cations comprise at least one of calcium ions and barium ions;
- and
- a pH in the range of about 9 to about 12.
1 more element
Dependencies are inferred from the claim text.