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US 2006/0133039 A1Published application
Fluid cooled integrated circuit module
AssigneeHewlett-Packard Development Company, L.P.
InventorChristian Belady
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) module has an IC die, a heat sink, a cooling fluid path and a fluid pump. The IC die, the heat sink and the fluid pump are mounted together. The fluid pump forces cooling fluid through the cooling fluid path to receive heat from the IC die and to transfer heat to the heat sink.
Claims31
A computer system comprising:
- a housing;
- a printed circuit board mounted within the housing;
- and
- an integrated circuit module mounted on the printed circuit board and comprising:
- an integrated circuit die that produces heat upon operation thereof;
- a heat sink mounted together with the integrated circuit die and that dissipates heat to ambient air within the housing;
- a cooling fluid path through which cooling fluid flows to receive the heat from the integrated circuit die and to transfer the heat to the heat sink;
- and
- a fluid pump mounted together with the heat sink and integrated circuit die and in line with the cooling fluid path to force the cooling fluid through the cooling fluid path.
6 more elements
An integrated circuit module comprising:
- an integrated circuit die that produces heat upon operation thereof;
- a heat sink mounted together with the integrated circuit die and that dissipates heat;
- a cooling fluid path through which cooling fluid flows to receive the heat from the integrated circuit die and to transfer the heat to the heat sink;
- and
- a fluid pump mounted together with the heat sink and integrated circuit die and in line with the cooling fluid path to force the cooling fluid through the cooling fluid path.
2 more elements
An integrated circuit module comprising:
- a means for generating heat upon operation of the integrated circuit module;
- a means for dissipating heat to ambient air;
- and
- a means for flowing cooling fluid between a location at which the heat can be transferred from the heat generating means to the cooling fluid and a location within the heat dissipating means at which the heat can be transferred from the cooling fluid to the heat dissipating means;
- and wherein the heat generating means, the heat dissipating means and the cooling fluid flowing means are mounted together in the integrated circuit module.
2 more elements
A heat sink for use with an integrated circuit package comprising:
- a base;
- heat dissipation fins extending from the base;
- a cooling fluid path within the base and the heat dissipation fins through which cooling fluid flows to receive the heat from the integrated circuit package at the base and to dissipate the heat at the heat dissipation fins;
- and
- a fluid pump mounted on the base and in line with the cooling fluid path to force the cooling fluid through the cooling fluid path.
2 more elements
A method of cooling an integrated circuit die within an integrated circuit module, comprising:
- generating heat by the integrated circuit die by operating the integrated circuit die;
- flowing cooling fluid through a location within the integrated circuit module at which the cooling fluid can receive the heat from the integrated circuit die to cool the integrated circuit die;
- flowing the cooling fluid through a heat sink mounted together with the integrated circuit die in the integrated circuit module, wherein the heat is transferred to the heat sink to cool the cooling fluid;
- and
- flowing the cooling fluid through a fluid pump mounted together with the heat sink and integrated circuit die in the integrated circuit module to pump the cooling fluid by the fluid pump back to the location at which the cooling fluid can receive the heat from the integrated circuit die.
2 more elements
Dependencies are inferred from the claim text.