Semiconductor wafer with protection structure against damage during a die separation process

Abstract

A semiconductor wafer includes one or more dies, each of which has a boundary surrounding an integrated circuitry for separating one from another. One or more pattern units are disposed adjacent to the die for monitoring a fabrication process thereof. A protection structure is disposed between the die and the pattern units for preventing the die from damage during a separation of the die from the semiconductor wafer. Thus, the semiconductor wafer is adapted to prevent damage during a die separation process.

Dependencies are inferred from the claim text.