Method and system for sealing a substrate
AssigneeIdc, LLC
InventorPhilip Floyd
Life of this patent
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Abstract
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
Claims35
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions, comprising:
- forming a substantially metal seal on a substrate comprising a MEMS device;
- and
- attaching a backplane to said metal seal so as to seal said MEMS device from ambient conditions.
A method of packaging a microelectromechanical system (MEMS) device, comprising:
- depositing an insulator over a MEMS device formed on a substrate, wherein the MEMS device includes a sacrificial layer;
- depositing one or more metal layers over the insulator;
- forming a mask with one or more cavities over the metal layer;
- forming one or more metal seal layers in the one or more cavities, thereby forming a substantially hermetic seal proximate a perimeter of the MEMS device;
- removing the mask layer, the one or more metal layers, and the insulating layer;
- removing the sacrificial layer from the MEMS device;
- and
- positioning a backplane in contact with the seal so as to seal the MEMS device from ambient conditions.
A system for sealing a microelectromechanical system (MEMS) device from ambient conditions, comprising:
- a MEMS device formed on a substrate;
- means for providing a substantially metal seal on said substrate and proximate a perimeter of said MEMS device, thereby forming a substantially hermetic seal proximate a perimeter of the MEMS device;
- and
- a backplane in contact with the substantially metal seal, thereby encapsulating the MEMS device within the substrate, the substantially metal seal, and the backplane.
A microelectromechanical system (MEMS) device sealed from ambient conditions, comprising:
- a MEMS device formed on a substrate;
- a substantially metal seal formed on the substrate proximate a perimeter of the MEMS device;
- and
- a backplane in contact with the substantially metal seal, thereby encapsulating the MEMS device within the substrate, the substantially metal seal, and the backplane.
Dependencies are inferred from the claim text.