CMP composition with a polymer additive for polishing noble metals
AssigneeCabot Microelectronics Corporation
InventorsFrancesco De Rege Thesauro, Benjamin Bayer
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Abstract
The invention provides a method of polishing a substrate comprising contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising (a) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof, (b) an oxidizing agent, (c) an ethylene-oxide containing polymer, and (d) a liquid carrier, and abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.
Claims21
A method of polishing a substrate comprising:
- (i) contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising:
- (a) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof,
- (b) an oxidizing agent selected from the group consisting of bromates, bromites, hypobromites, chlorates, chlorites, hypochlorites, perchlorates, hypoiodites, periodates, monoperoxy sulfate, organo-halo-oxy compounds, rare earth salts, and combinations thereof,
- (c) an ethylene-oxide containing polymer, and
- (d) a liquid carrier, and
- (ii) abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.
A method of polishing a substrate comprising:
- (i) contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising:
- (a) a polishing pad,
- (b) a liquid carrier,
- (c) an abrasive suspended in the liquid carrier,
- (d) potassium bromate present in the liquid carrier in an amount of about 0.1 wt. % to about 10 wt. % based on the weight of the liquid carrier and any components dissolved or suspended therein,
- (e) an ethylene-oxide containing polymer ethylene-oxide containing polymer having a molecular weight of about 7500 to about 10000 Daltons present in the liquid carrier, and
- (ii) abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.
A method of polishing a substrate comprising:
- (i) contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising:
- (a) a polishing pad,
- (b) a liquid carrier,
- (c) an abrasive suspended in the liquid carrier,
- (d) an oxidizing agent in the liquid carrier,
- (e) a dialkylsiloxane-ethylene oxide block copolymer in the liquid carrier, and
- (ii) abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.
Dependencies are inferred from the claim text.