Temperature measuring device using a matrix switch, a semiconductor package and a cooling system
OwnerYun-Hyeok Im, Suk-Chae Kang +1inventors
InventorsYun-Hyeok Im, Suk-Chae Kang, Hee-Seok Lee
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Abstract
An embodiment relates to a temperature measuring device using a matrix switch, and a semiconductor package. In another embodiment a cooling system may be included. A plurality of temperature sensors may be arranged on a surface of a semiconductor device. The matrix switch may select the temperature sensors by an address method to form a circuit that includes the selected temperature sensor. A measuring unit may receive an output signal of the selected temperature sensor to calculate the temperature at the selected temperature sensor.
Claims20
A temperature measuring device comprising:
- a semiconductor device;
- temperature sensors arranged on a surface of the semiconductor device;
- a matrix switch to select the temperature sensors by an address to form a circuit that includes the selected temperature sensor, and to output an output signal of the selected temperature sensor;
- and
- a measuring unit to receive the output signal and to calculate the temperature at the selected temperature sensor.
A device comprising:
- a semiconductor chip having a temperature sensing unit;
- and
- an external connection terminal electrically connected to the semiconductor chip and having a temperature output terminal to transmit an output signal output from the temperature sensing unit to outside the semiconductor chip,
- wherein the temperature sensing unit includes a plurality of temperature sensors arranged on a surface of the semiconductor chip, and a matrix switch to select the temperature sensors by an address to form a closed loop that includes the selected temperature sensor, and to output an output signal of the selected temperature sensor to the temperature output terminal.
A method of detecting temperatures of a semiconductor device comprising:
- placing temperature sensors on a surface of the semiconductor device in a matrix configuration, each of the temperature sensors addressable by corresponding row and column addresses;
- selectively connecting the temperature sensors using the row and column addresses to a measuring unit;
- receiving output signals from the connected temperature sensors by the measuring unit;
- converting the received output signals to temperature values;
- and
- outputting the temperature values.
Dependencies are inferred from the claim text.