Film sticking method and film sticking device

A film sticking method for sticking a film on a pattern forming face of a wafer, on the pattern forming face of which circuit patterns are formed, comprising the steps of:

• positioning the wafer in a first orientation so that a sticking direction of a film sticking means for sticking the film on the pattern forming face by moving the film sticking means in a predetermined sticking direction on the pattern forming face of the wafer can be substantially parallel with the bisector of a corner portion of the circuit pattern;
• sticking the film on the pattern forming face of the wafer by moving the film sticking means in the sticking direction on the pattern forming face of the wafer;
• grinding a face on the opposite side to the pattern forming face of the wafer;
• positioning the wafer in a second orientation rotated by 90° round the centeraxis of the wafer from the first direction;
• feeding a peeling tape onto the film stuck on the pattern forming face of the wafer;
• contacting the peeling tape with the film on the wafer;
• and
• peeling the film together with the peeling tape from the pattern forming face on the wafer by moving a film peeling means in a peeling direction, which is parallel with the sticking direction, on the pattern forming face of the wafer.

A film sticking device for sticking a film on a pattern forming face of a wafer, on the pattern forming face of which circuit patterns are formed, comprising:

• a positioning means for supportably positioning the wafer;
• and
• a film sticking means for sticking the film on the pattern forming face by moving the film sticking means in a predetermined sticking direction on the pattern forming face of the wafer, wherein
• after the wafer is positioned by the positioning means so that the sticking direction of the film sticking means can be substantially parallel with the bisector of a corner portion of the circuit pattern, the film is stuck on the pattern forming face of the wafer by moving the film sticking means in the sticking direction on the pattern forming face of the wafer.

A film sticking device for sticking a film on a pattern forming face of a wafer, on the pattern forming face of which circuit patterns are formed, comprising:

• a positioning means for supportably positioning the wafer;
• a film sticking means for sticking the film on the pattern forming face by moving the film sticking means in a predetermined sticking direction on the pattern forming face of the wafer;
• a grinding means for grinding a face on the opposite side to the pattern forming face of the wafer;
• a tape feeding means for feeding a peeling tape onto the film stuck on the pattern forming face of the wafer;
• and
• a film peeling means for peeling the film together with the peeling tape from the pattern forming face of the wafer by moving the film peeling means in a peeling direction parallel with the sticking direction on the pattern forming face, wherein
• after the wafer is positioned by the positioning means in a first orientation so that the sticking direction of the film sticking means can be substantially parallel with the bisector of a corner portion of the circuit pattern, the film is stuck on the pattern forming face of the wafer by moving the film sticking means in the sticking direction on the pattern forming face of the wafer,
• after a face on the opposite side to the pattern forming face is ground by the grinding means, the wafer is positioned by the positioning means in a second orientation rotated by 90° round the centeraxis of the wafer from the first direction so as to contact the film of the wafer with the peeling tape fed by the feeding means, and
• the film is peeled from the pattern forming face of the wafer together with the peeling tape by moving the film peeling means in a peeling direction parallel with the sticking direction on the pattern forming face.