US 2006/0068299 A1 · Multi wavelength multi layer printing

Abstract

A mask for exposing a first layer and a second layer on a process substrate, where the first and second layers are two separate layers of an integrated circuit. The mask includes a mask substrate that is substantially completely transmissive to a first wavelength of light and a second wavelength of light. A layer of a first material is disposed on the mask substrate, where the first material is substantially opaque to the first wavelength of light. The layer of the first material is patterned for the first layer. A layer of a second material is disposed on the mask substrate, where the second material is substantially opaque to the second wavelength of light. The layer of the second material is patterned for the second layer, where the first layer and the second layer are aligned on the mask substrate.

Claims20

Dependent claims

A mask for exposing a first layer and a second layer on a process substrate, where the first and second layers are two separate layers of an integrated circuit, the mask comprising:

a mask substrate, where the mask substrate is substantially completely transmissive to a first wavelength of light and a second wavelength of light,
a layer of a first material disposed on the mask substrate, where the first material is substantially opaque to the first wavelength of light, and the layer of the first material is patterned for the first layer, and
a layer of a second material disposed on the mask substrate, where the second material is substantially opaque to the second wavelength of light, and the layer of the second material is patterned for the second layer, where the first layer and the second layer are aligned on the mask substrate.

A method for exposing a first layer and a second layer on a process substrate, where the first and second layers are two separate layers of an integrated circuit, the method comprising the steps of:

processing the process substrate in preparation for the first layer,
aligning the process substrate to a mask for forming the first layer,
exposing the first layer with a first wavelength of light through the mask, where the mask is patterned with a first material that is substantially transmissive to all wavelengths of light except for the first wavelength of light, thereby blocking selected portions of the first wavelength of light from passing through the mask,
processing the process substrate according to the first layer,
processing the process substrate in preparation for the second layer,
aligning the process substrate to the mask for forming the second layer,
exposing the second layer with a second wavelength of light through the mask, where the mask is patterned with a second material that is substantially transmissive to all wavelengths of light except for the second wavelength of light, thereby blocking selected portions of the second wavelength of light from passing through the mask, where the first material and the second material are aligned on the mask, and
processing the process substrate according to the second layer.

5 more elements

Dependencies are inferred from the claim text.

Multi wavelength multi layer printing

Life of this patent

Multi wavelength multi layer printing

Life of this patent

Abstract

Claims20