System and method for providing scalability in an integrated circuit
AssigneeLSI Logic Corporation
InventorsMichael Casey, Hong Hao
Life of this patent
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Abstract
The invention provides a system and method for providing scalability in an integrated circuit (IC) having a package coupled to a die through package balls. The die includes a plurality of input/output (I/O) slots and a hardmac configured to implement a logic function. A patch board is included between the hardmac and the I/O slots, wherein the hardmac includes a plurality of attachment points. The hardmac is attached to the plurality of I/O slots through the patch board, wherein adjacent attachment points join to non-adjacent I/O slots through the patch board.
Claims25
A system for providing scalability in an integrated circuit (IC) having a package with package balls, the system comprising:
- a die coupled to the package through the package balls, the die including;
- a hardmac configured to implement a logic function and having a plurality of attachment points;
- a plurality of input/output (I/O) slots;
- a patch board coupled to the hardmac and to the I/O slots and configured to connect adjacent attachment points to non-adjacent I/O slots.
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Dependencies are inferred from the claim text.