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AssigneeOpto Tech Corporation
InventorsHung-Tung Wang, Chien-Chen Hung, Shun-Lih Tu, Dennis Yen, Chih-Hung Chuang, Huai-Ku Chung, Cheng-Wei Yang, Tsu-An Han
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The present invention relates to a high-power LED array. The high-power LED array has a printed circuit board (PCB), anodes, cathodes, high-power LED dies, packing materials, and lenses. The PCB has cavities arranged in an array. One anode and one cathode are located in each cavity. The anode and the cathode are correspondingly connected to the anode and cathode in the neighboring cavities. At least one high-power LED die is placed in the cavity and connected to the anode and the cathode in series or in parallel. The cavity is filled with packing material to secure the high-power LED die. Lenses are placed on the cavities to focus light emitted by the high-power LED die.
A high-power LED array, the high-power LED array comprising:
A high-power LED array packing method for packing a high-power LED array on a printed circuit board, the printed circuit board including a plurality of cavities, the cavities including anodes and cathodes, the anodes being electrically connected, and the cathodes being electrically connected, the high-power LED array packing method comprising:
Dependencies are inferred from the claim text.