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US 2006/0037738 A1Published application
Heat-dissipating device with heat pipe
AssigneeInventec Corporation
InventorsChin-Yuan Li, Mao-Ching Lin
Life of this patent
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Abstract
A heat-dissipating device with heat pipe includes a base having a plurality of pipe spaces therein; a plurality of heat pipes vertically mounted on the base and connected to the pipe spaces respectively; a working fluid filled in the pipe spaces; and a plurality of heat-dissipating fins attached to the plurality of heat pipes and spaced from each other by a predetermined distance. This heat-dissipating device can achieve heat dissipation without bending the heat pipes.
Claims18
A heat-dissipating device with heat pipe, comprising:
- a base having at least one pipe space therein;
- a plurality of heat pipes vertically mounted on the base and connected to the pipe space respectively;
- a working fluid filled in the pipe space;
- and
- a plurality of heat-dissipating fins attached to the plurality of heat pipes and spaced from each other by a predetermined distance.
2 more elements
A heat-dissipating device with heat pipe, comprising:
- a base having at least one pipe space therein;
- at least one heat pipe horizontally connected to the pipe space;
- a working fluid filled in the pipe space;
- and
- a plurality of heat-dissipating fins attached to the heat pipe and spaced from each other by a predetermined distance.
2 more elements
Dependencies are inferred from the claim text.