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US 2005/0239267 A1Published application
Substrate manufacturing method
AssigneeCanon Kabushiki Kaisha
InventorShuji Tobashi
Life of this patent
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Abstract
A substrate manufacturing method includes steps of preparing a bonded substrate stack formed by bonding a second substrate to a first substrate having an insulator at least on a surface, forming a gettering layer to capture a metal contamination on the surface of the bonded substrate stack to form a composite substrate stack, annealing the composite substrate stack, and removing the gettering layer from the composite substrate stack.
Claims15
A substrate manufacturing method comprising steps of:
- preparing a bonded substrate stack formed by bonding a second substrate to a first substrate having an insulator at least on a surface;
- forming a gettering layer to capture a metal contamination on a surface of the bonded substrate stack to form a composite substrate stack;
- annealing the composite substrate stack;
- and
- removing the gettering layer from the composite substrate stack.
2 more elements
A substrate manufacturing method comprising steps of:
- preparing a first substrate which has an insulator at least on a surface and a second substrate in which a gettering layer to capture a metal contamination is formed on a surface;
- bonding the first substrate and second substrate so as to arrange the gettering layer on a surface to form a composite substrate stack;
- annealing the composite substrate stack;
- and
- removing the gettering layer from the composite substrate stack.
2 more elements
Dependencies are inferred from the claim text.