Electronic assembly, and apparatus and method for the assembly thereof
AssigneeGeneral Electric Company
InventorsHabib Vafi, Faisal Saeed
Life of this patent
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Abstract
An electronic assembly having a first layer and a second layer is disclosed. The first layer has a first interface surface and a plurality of cavities formed in the first interface surface. The second layer has a second interface surface and a plurality of projections disposed at the second interface surface, where the plurality of projections are aligned with and disposed at the plurality of cavities. An electrically conductive connecting material is disposed at the plurality of cavities such that the connecting material connects the plurality of projections to the respective plurality of cavities.
Claims17
An electronic assembly comprising:
- a first layer having a first interface surface and a plurality of cavities formed in the first interface surface;
- a second layer having a second interface surface and a plurality of electrically conductive projections disposed at the second interface surface, wherein the plurality of projections are aligned with and disposed at the plurality of cavities, the second layer comprising a diode array having a plurality of backlit photodiodes in electrical communication with the plurality of projections;
- and
- an electrically conductive connecting material disposed at the plurality of cavities such that the connecting material non-separably connects the plurality of projections to the respective plurality of cavities, each of the plurality of cavities being configured to constrain the connecting material disposed thereat from outward flow;
- wherein the plurality of cavities are formed having a depth d in the first interface surface;
- wherein the first interface surface is disposed part from the second interface surface by a gap g;
- and
- wherein the plurality of projections have a length h that is equal to or less than the sum of the depth d and the gap g, such that the connecting material bridges the distance defined by (d+g−h).
(canceled)
(canceled)
15-34. (canceled)
An electronic assembly comprising:
- a first layer having a plurality of pockets;
- a second layer comprising a diode array having a plurality of backlit photodiodes having a plurality of electrically conductive projections, wherein the plurality of projections are aligned with and disposed at the plurality of pockets with a defined distance therebetween;
- and
- an electrically conductive connecting material disposed at the plurality of pockets such that the plurality of projections are electrically and non-separably bonded to the respective plurality of pockets via the electrically conductive connecting material;
- wherein the conductive connecting material bridges the defined distance;
- and
- wherein each of the plurality of pockets are configured to constrain the connecting material disposed thereat from outward flow.
A multi-layer backlit photodiode array electronic assembly, comprising:
- a first layer having a plurality of pockets formed in a first interface spice;
- a second layer having a plurality of electrically conductive projections disposed at a second interface surface, wherein the plurality of projections are aligned with and disposed at the plurality of cavities, and wherein the plurality of ections and the plurality of pockets are spaced apart by a defined distance;
- and
- an electrically conductive connecting material disposed between the plurality of pockets and the plurality of projections such that the connecting material bridges the defined distance and non-separably connects the plurality of projections to the plurality of pockets, each of the plurality of pockets being configured to constrain the connecting material disposed thereat from outward flow;
- wherein the second layer comprises the backlit photodiode army.
Dependencies are inferred from the claim text.