Structure for isolating thermal interface material

Abstract

A structure for isolating thermal interface material includes an isolating element and a heat dissipating element. The isolating element is hollow to encompass a heat generating element. With compression of the heat dissipating element on the heat generating element, thermal interface material between them is limited to flow within the closed room between the isolation element and heat generating element. The heat dissipating element further has a bump exactly contacting the heat generating element and a little smaller than the hollow portion of the isolating element. Therefore, the thermal interface material would not overflow while changing from solid phase to a gel or a liquid phase caused by raising temperature of the heat generating element, and the contamination or short circuits can be prevented.

Dependencies are inferred from the claim text.