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US 2005/0031323 A1Published application
Hot plate unit
AssigneeIbiden Co., Ltd.
InventorsJo Saito, Masakazu Furukawa, Yasutaka Ito
Life of this patent
Estimating the term…
Abstract
A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.
Claims5
A hot plate unit comprising:
- a hot plate having a heat generator;
- a case having a hole for a wire that supplies electric current to the heat generator , wherein the case and the hot plate define a space in which a cooling fluid flows;
- and a seal element for sealing the hole.
A hot plate unit comprising:
- a hot plate having a heat generator;
- a case having a lip, wherein the case has a hole for a wire that supplies electric current to the heat generator, and wherein the case and the hot plate define a space in which a cooling fluid flows;
- at least one intake port extending through the case;
- and
- a seal element for sealing the hole.
2 more elements
A hot plate unit comprising:
- a hot plate having a heat generator;
- a case having a lip, wherein the case has a hole for a wire that supplies electric current to the heat generator, and wherein the case and the hot plate define a space in which a cooling fluid flows;
- at least one intake port extending through the case;
- and
- a seal element for sealing the hole, wherein the seal element includes a ring packing made of elastic material.
2 more elements
Dependencies are inferred from the claim text.