Interposer with integral heat sink
AssigneeAirBorn, Inc.
InventorsMichael Cuff, John Grant
Life of this patent
Estimating the term…
Abstract
An area array connector for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element is described. The area array connector includes at least one electrically conductive interconnector adapted to provide an electrical interconnection between the first circuit element and the second circuit element. The area array connector also includes at least one thermally conductive member adapted to provide thermal interconnection between the first circuit element and the second circuit element.
Claims34
A connector assembly for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element, the connector assembly comprising:
- an interposer;
- at least one electrically conductive interconnector disposed within the interposer, the at least one electrically conductive interconnector adapted to provide an electrical interconnection between the first circuit element and the second circuit element;
- and
- at least one thermally conductive member in association with the interposer, the at least one thermally conductive member adapted to provide a conductive thermal interconnection between the first circuit element and the second circuit element.
A connector assembly for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element, the connector assembly comprising:
- an interposer having at least one thermally conductive member integrally formed therewith, the at least one thermally conductive member adapted to transfer thermal energy between the first circuit element and the second circuit element;
- and
- at least one electrically conductive interconnector disposed within the interposer, the at least one electrically conductive interconnector adapted to provide an electrical interconnection between the first circuit element and the second circuit element.
A method of forming a connector assembly for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element, the method comprising:
- forming an interposer including a central void;
- forming a heat sink configured to be positioned substantially within the central void;
- and
- fastening the heat sink to the interposer.
A method of forming a connector assembly for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element, the method comprising:
- forming a heat sink including a central void;
- forming an interposer configured to be positioned substantially within the central void;
- and
- fastening the heat sink to the interposer.
Dependencies are inferred from the claim text.