Solid-state image sensing device, manufacturing method and attachment method thereof, imaging apparatus and image read unit for imaging apparatus

A manufacturing method of a solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side and allows light to pass through the light-receiving section;
• and
• inner and outer protective films that are made adhered to the surface of the light-receiving side of the cover member in a detachable manner, wherein
• the method comprising the steps of:
• applying an adhesive to at least a part of a circumferential area of the cover member,
• arranging the inner protective film on a portion without the adhesive applied of the cover member, and
• disposing the outer protective film on the cover member on which the inner protective film is arranged, in such a manner that the inner protective film is arranged between the cover member and the outer protective film, to adhere the outer protective film to the cover member.

A manufacturing method of a solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side and allows light to pass through the light-receiving section;
• and
• inner and outer protective films that are made adhered to the surface of the light-receiving side of the cover member in a detachable manner, wherein
• the method comprising the steps of:
• applying an adhesive to at least a part of a circumferential area of the cover member,
• arranging the inner protective film on the outer protective film, and
• disposing the outer protective film on which the inner protective film is arranged on the cover member, in such a manner that the inner protective film is arranged between the cover member and the outer protective film, to adhere the outer protective film to the cover member.

A manufacturing method of a solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side and allows light to pass through the light-receiving section;
• and
• inner and outer protective films that are made adhered to the surface of the light-receiving side of the cover member in a detachable manner, wherein
• the method comprising the steps of:
• arranging the inner protective film on the cover member,
• applying an adhesive to at least a part of a circumferential area of the outer protective film, and
• disposing the outer protective film with the adhesive on the cover member on which the inner protective film is arranged, in such a manner that the inner protective film is arranged between the cover member and the outer protective film, to adhere the outer protective film to the cover member.

A manufacturing method of a solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side and allows light to pass through the light-receiving section;
• and
• inner and outer protective films that are made adhered to the surface of the light-receiving side of the cover member in a detachable manner, wherein
• the method comprising the steps of:
• applying an adhesive to at least a part of a circumferential area of the outer protective film,
• arranging the inner protective film on a portion without the adhesive applied of the outer protective film, and
• disposing the outer protective film on which the inner protective film is arranged on the cover member, in such a manner that the inner protective film is arranged between the cover member and the outer protective film, to adhere the outer protective film to the cover member.

A method of attaching a solid-state image sensing device to an attached section of an apparatus,

• the image sensing device comprising:
• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side and allows light to pass through the light-receiving section;
• and
• a protective member that is adhered to the surface of the light-receiving side of the cover member in a detachable manner,
• an adhesion section between the cover member and the protective member being provided on a circumferential area of the cover member, and wherein the front face of the light-receiving section is kept clear of adhesive,
• the method comprising the steps of:
• detaching the protective member from the surface of the light-receiving side of the cover member, and
• attaching the solid-state image sensing device to the attached section of the apparatus without performing any surface processing to the surface of the light-receiving side.

An imaging apparatus that adopts a solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side and allows light to pass through the light-receiving section;
• and
• a protective member that is adhered to the surface of the light-receiving side of the cover member in a detachable manner,
• an adhesion section between the cover member and the protective member being provided on a circumferential area of the cover member, and wherein the front face of the light-receiving section is kept clear of adhesive.

An image read unit for an imaging apparatus that adopts a solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side and allows light to pass through the light-receiving section;
• and
• a protective member that is adhered to the surface of the light-receiving side of the cover member in a detachable manner,
• an adhesion section between the cover member and the protective member being provided on a circumferential area of the cover member, and wherein the front face of the light-receiving section is kept clear of adhesive.

A solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side;
• a protective member that is adhered to the surface of the light-receiving side of the cover member in a detachable manner;
• wherein the cover member is at least translucent;
• and
• wherein an adhesion section between the cover member and the protective member is defined on at least a portion of a circumferential area of the cover member;
• and
• wherein an adhesive is applied to at least one of the cover member and the protective member in the adhesion section;
• and
• wherein an area of the cover member providing access for light to reach the light-receiving section is kept clear of adhesive.

A manufacturing method of a solid state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side;
• and
• a protective member that is made to adhered to the surface of the light-receiving side of the cover member in a detachable manner,
• wherein an adhesion section between the cover member and the protective member is provided on at least a part of a circumferential area of the cover member,
• wherein no adhesive is provided between the cover member and the protective member in the area of the cover member allowing light to access the light-receiving section,
• wherein the cover member is not opaque,
• the manufacturing method comprising the steps of:
• applying adhesive to at least one of the cover member and the protective member in the adhesion section,
• fixing the protective member to the surface of the cover member in a detachable manner.

A method of attaching a solid-state image sensing device to an attached section of an apparatus, the image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side;
• and
• a protective member that is made to adhere to the surface of the light-receiving side of the cover member in a detachable manner,
• an adhesion section between the cover member and the protective member being provided on at least a circumferential area of the cover member not including an area defined by a front face of the light-receiving section where light passes through the cover member to the light-receiving section,
• wherein the cover member is at least translucent,
• the method comprising the steps of:
• detaching the protective member from the surface of the light-receiving side of the cover member, and
• attaching the solid-state image sensing device to the attached section of the apparatus without performing any surface processing to the surface of the light-receiving side of the cover member.

An imaging apparatus that adopts a solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subject to light;
• a cover member that covers the light-receiving section from a light-receiving side;
• and
• a protective member that is made to adhere to the surface of the light-receiving side of the cover member in a detachable manner, and
• an adhesion section between the cover member and the protective member being provided on at least a portion of a circumferential area of the cover member, not including the an area corresponding to the front face of the light-receiving section,
• wherein the cover member allows light to pass through to the light-receiving section.

An image read unit for an imaging apparatus that adopts a solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section from a light-receiving side;
• and
• a protective member that is made to adhere to the surface of the light-receiving side of the cover member in a detachable manner,
• an adhesion section between the cover member and the protective member provided on a circumferential area of the cover member, keeping clear of the front face of the light-receiving section, and
• wherein the cover member is at least translucent.

A solid-state image sensing device comprising:

• a light-receiving section that generates electric signals when subjected to light;
• a cover member that covers the light-receiving section;
• a protective member that is adhered to the surface of the light-receiving side of the cover member in a detachable manner;
• wherein the cover member is not opaque;
• and
• wherein an adhesion section between the cover member and the protective member is defined on at least a portion of a circumferential area of the cover member;
• and
• wherein an adhesive is applied to one of the cover member and the protective member in the adhesion section;
• and
• wherein an area of the cover member providing access for light to reach the light-receiving section is kept free of adhesive.