Method for quartz bump defect repair with less substrate damage
AssigneeMicron Technology, Inc.
InventorsBaorui Yang, Matthew Lamantia
Life of this patent
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Abstract
A method for minimizing damage to a substrate while repairing a defect in a phase shifting mask for an integrated circuit comprising locating a bump defect in a phase shifting mask, depositing a first layer of protective coating to an upper surface of the bump defect, depositing a second layer of protective coating to areas of the phase shifting mask adjacent the bump defect, etching the first layer of protective coating and removing the bump defect.
Claims28
-54. (Cancelled).
An apparatus for repairing a bump defect in a mask, said apparatus comprising:
- an inspection system for locating said bump defect on said mask;
- a processing system for depositing a first layer of protective material onto said mask such that a first portion of said layer is over said located bump defect and a second portion of said layer is on areas of said mask adjacent said located bump defect;
- a removal system for removing said first portion of said layer and exposing said located bump defect;
- and
- an ion beam emitter for removing said exposed bump defect.
An apparatus for repairing a defect in a mask, said apparatus comprising:
- a processing system for depositing a layer of protective material onto an area of said mask, said area having at least one bump defect;
- an inspection system for locating in said area said at least one bump defect;
- a removal system for removing a portion of said layer of protective material covering an upper surface of said at least one bump defect thereby exposing said at least one bump defect, and for removing said at least one bump defect.
An intermediate product for use in removing bump defects from a mask, said product comprising:
- a transparent mask substrate, an area of said transparent substrate containing at least one transparent bump defect;
- a first protective material layer covering a top surface of said at least one bump defect;
- and
- a second protective material layer covering areas of said mask adjacent said at least one bump defect.
An intermediate product for use in removing bump defects from a mask, said product comprising:
- a transparent mask substrate, an area of said transparent substrate containing at least one transparent bump defect;
- and
- a protective layer of material covering areas of said mask adjacent said at least one bump defect.
Dependencies are inferred from the claim text.