Discrete circuit component having an up-right circuit die with lateral electrical connections

A discrete circuit component having an up-right circuit die with a plurality of lateral electrodes, said component comprising:

• a substrate having a plurality of electrically conductive traces;
• a circuit die planted between said plurality of conductive traces, wherein each electrode of said circuit die on the lateral surface thereof vertical to said substrate being electrically bonded to the corresponding one of said conductive traces immediately next thereto;
• a body of electrical insulation material hermetically sealing said circuit die;
• and
• a plurality of surface electrodes formed on the surface of said body of insulation material each electrically connected to the corresponding one of said plurality of electrically conductive traces extending from said circuit die.

A discrete circuit component rack having a plurality of discrete circuit components connected physically together in a row and electrically independent to each other, each of said discrete circuit components having an up-right circuit die with lateral electrical connections, said component comprising:

• a substrate having a pair of electrically conductive traces;
• a circuit die planted between said pair of consecutive traces, wherein one electrode of said circuit die on the surface thereof vertical to said substrate being electrically bonded to one of said conductive traces immediately next thereto, and the other electrode of said circuit die on the opposite surface thereof vertical to said substrate being electrically bonded to the other of said pair of conductive traces immediately next thereto;
• a body of electrical insulation material hermetically sealing said circuit die;
• and
• a pair of surface electrodes formed on the surface of said body of insulation material each electrically connected to the corresponding one of said pair of electrically conductive traces extending from said circuit die.

A discrete circuit component rack having a plurality of discrete circuit components connected physically together in a row and electrically independent to each other, each of said discrete circuit components having an up-right circuit die with lateral electrical connections, said component comprising:

• a substrate having a plurality of electrically conductive traces;
• a circuit die planted between said plurality of conductive traces, wherein each electrode of said circuit die on the lateral surface thereof vertical to said substrate being electrically bonded to the corresponding one of said conductive traces immediately next thereto;
• a body of electrical insulation material hermetically sealing said circuit die;
• and
• a plurality of surface electrodes formed on the surface of said body of insulation material each electrically connected to the corresponding one of said plurality of electrically conductive traces extending from said circuit die.

A process for fabricating a discrete circuit component having an up-right circuit die with lateral electrical connections comprising the steps of:

• (a) forming an array of a plurality of electrical conductive traces on the surface of a substrate;
• (b) planting one circuit die between each pair of consecutive ones of said conductive traces;
• (c) electrically connecting each electrode of each of said circuit dice on the corresponding one of both lateral sides of said circuit die onto the proximate one of said pair of conductive traces with an electrically conductive bonding material;
• and
• (d) covering and sealing each of said circuit dice.