Multilayered integrated circuit with extraneous conductive traces

A process of making a multilayered integrated circuit comprising the steps of:

• forming an upper conductive layer having upper conductive lines for carrying electrical signals among components of the integrated circuit;
• forming a lower conductive layer having lower conductive lines for carrying electrical signals among components of the integrated circuit;
• forming an intermediate layer having via holes electrically connecting the upper conductive lines with the lower conductive lines;
• forming extraneous conductive lines in at least one conductive layer among the upper conductive layer and lower conductive layer, the extraneous conductive lines being made of a material which is the same of the material of the upper and lower conductive lines, the extraneous conductive lines performing functions which are unnecessary to the operation of the integrated circuit.

A method of designing a multilayered electronic circuit comprising functional conductive lines for transmission of electric signals and extraneous conductive lines, the designed multilayered circuit being suitable for making a corresponding three-dimensional multilayered electronic circuit, the method comprising:

• providing a representation of a first conductive layer having first layer functional conductive lines for carrying electrical signals among components of the electronic circuit;
• providing a representation of a second conductive layer having second layer functional conductive lines for carrying electrical signals among components of the electronic circuit;
• providing a representation of functional via holes electrically connecting the first layer conductive lines with the second layer conductive lines;
• and
• providing a representation of extraneous conductive lines to be inserted in at least one layer among the first conductive layer and the second conductive layer.

A process of making an electronic circuit comprising the steps of:

• providing functional conductive lines for carrying electrical signals among components of the electronic circuit;
• providing functional via holes for electrical connection of the functional conductive lines;
• providing extraneous conductive lines, the extraneous conductive lines performing functions which are unnecessary to the operation of the electronic circuit;
• and
• providing extraneous via holes for electrical connection of the extraneous conductive lines.