Systems and methods for forming data storage devices
AssigneeHewlett-Packard Development Company, L.P.
InventorChris L. Morford
Life of this patent
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Abstract
Systems for assembling wafer stacks are provided. An embodiment of the system includes a vacuum chamber, a media deposition component and a wafer stack assembly component. The media deposition component is arranged within the vacuum chamber and is configured to deposit storage media upon a first wafer. The wafer stack assembly component also is arranged within the vacuum chamber. The wafer stack assembly component is configured to align the first wafer and a second wafer relative to each other and bond the first wafer and the second wafer together while at least a portion of the vacuum chamber is maintained under vacuum pressure. So configured, the interior chamber of the wafer stack can be formed as well as maintained under vacuum pressure. Methods also are provided.
Claims20
A system for assembling a wafer stack, the wafer stack being adapted to form a data storage device, the wafer stack including a first wafer and a second wafer, the first wafer and second wafer defining therebetween an interior chamber, said system comprising:
- a vacuum chamber;
- a media deposition component arranged within said vacuum chamber, said medium deposition component being configured to deposit storage media upon the first wafer;
- and
- a wafer stack assembly component arranged within said vacuum chamber, said wafer stack assembly component being configured to align the first wafer and a second wafer relative to each other and bond the first wafer and the second wafer together while at least a portion of said vacuum chamber is maintained under vacuum pressure such that the interior chamber of the wafer stack is maintained under vacuum pressure.
A method for forming a data storage device comprising:
- providing a first wafer and a second wafer, the first wafer and second wafer being configured to define therebetween an interior chamber;
- maintaining the first wafer under vacuum pressure;
- depositing storage media upon the first wafer;
- removing contaminants from a vicinity of the first wafer;
- and
- bonding the first wafer and the second wafer together to form a wafer stack such that the interior chamber is maintained under vacuum pressure after the first wafer and second wafer are bonded together.
Dependencies are inferred from the claim text.