Development apparatus for manufacturing semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorsKeizo Shimada, Yasuharu Ohta
Life of this patent
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Abstract
A development apparatus for discharging a developer onto a surface of a semiconductor substrate (15) comprises a nozzle pipe (13) for supplying the developer, and a nozzle (14) having a shape of a spoon with a taper and discharging the developer supplied by the nozzle pipe onto the surface of the substrate. The nozzle sprays the developer onto the surface of the substrate at any spray angle under a low and constant pressure.
Claims5
A development apparatus for manufacturing a semiconductor device, said development apparatus discharging a developer onto a surface of a semiconductor substrate and comprising:
- a nozzle pipe for supplying said developer;
- and
- a nozzle having a shape of a spoon with a taper and discharging said developer supplied by said nozzle pipe onto said surface of said substrate, wherein said nozzle sprays said developer onto said surface of said substrate at any spray angle under a low and constant pressure.
A development apparatus for manufacturing a semiconductor device, said development apparatus discharging a developer onto a surface of a semiconductor substrate and comprising:
- a nozzle pipe for supplying said developer;
- a nozzle having a shape of a spoon with a taper and discharging said developer supplied by said nozzle pipe onto said surface of said substrate;
- and
- a scanning device for simultaneously scanning said nozzle pipe and said nozzle above said substrate in a stationary state, wherein said nozzle sprays said developer onto said surface of said substrate at any spray angle under a low and constant pressure.
Dependencies are inferred from the claim text.