Semiconductor package assembly and method for electrically isolating modules
AssigneeMicron Technology, Inc.
InventorsSion C. Quinlan, Tim J. Bales
Life of this patent
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Abstract
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
Claims89
An integrated circuit package assembly for electrically isolating modules, comprising:
- a substrate having a first side and an opposing second side;
- a first module attached to the first side of the substrate;
- a second module attached to the first side of the substrate;
- a first conductive surface proximate to the second side of the substrate, the first conductive surface conductively coupled to the first module;
- and
- a second conductive surface spaced apart from the first conductive surface to form a capacitor with the first conductive surface, the second conductive surface being coupled to the second module.
An integrated circuit package assembly for electrically isolating integrated circuits within a module, comprising:
- a substrate having a first side and an opposing second side;
- a module attached to the first side of the substrate, the module having a first and second integrated circuit;
- a first conductive surface proximate to the second side of the substrate, the first conductive surface conductively coupled to the first integrated circuit;
- and
- a second conductive surface spaced apart from the first conductive surface to form a capacitor with the first conductive surface, the second conductive surface being conductively coupled to the second integrated circuit.
An integrated circuit package assembly for electrically isolating modules, comprising:
- a first substrate with a first and opposing second side having a first module attached to the first side;
- a first conductive surface proximate to the second side of the first substrate, the first conductive surface being conductively coupled to the first module;
- a second substrate with a first and opposing second side having a second module attached to the first side;
- and
- a second conductive surface proximate to the opposing side of the second substrate, the second conductive surface being conductively coupled to the second module and spaced apart from the first conductive surface to form a capacitor with the first conductive surface.
An integrated circuit package assembly for electrically isolating integrated circuits within a module, comprising:
- a substrate;
- a first module having a first and opposing second side attached to the substrate on the first side;
- a second module having a first and opposing second side attached to the substrate on the first side;
- a non-conductive layer having a first and opposing second side, the first side proximate to the opposing second sides of the first and second modules;
- a first conductive surface proximate to the second side of the first non-conductive layer, the first conductive surface conductively coupled to the first module;
- and
- a second conductive surface spaced apart from the first conductive surface to form a capacitor with the first conductive surface, the second conductive surface being conductively coupled to the second module.
An integrated circuit package assembly for electrically isolating modules, comprising:
- a substrate having a first side and an opposing second side;
- a first module having a first and opposing second side attached to the first side of the substrate on the first side of the first module;
- a second module attached to the second side of the first module;
- a first conductive surface proximate to the second side of the substrate, the first conductive surface conductively coupled to the first module;
- and
- a second conductive surface spaced apart from the first conductive surface to form a capacitor with the first conductive surface, the second conductive surface being coupled to the second module.
A method of electrically isolating modules within an integrated circuit package assembly, comprising:
- attaching a first and second module to a substrate having a first and opposing second side;
- providing a first conductive surface having a first and opposing second side abutting the opposing second side of the substrate;
- providing a dielectric layer having a first and opposing second side abutting the opposing second side of the first conductive surface;
- providing a second conductive surface abutting the opposing second side of the dielectric;
- conductively coupling the first conductive surface to the first module;
- and
- conductively coupling the second conductive surface to the second module.
A method of electrically isolating modules within an integrated circuit package assembly, comprising:
- forming a capacitor within the semiconductor package assembly, the capacitor having a first terminal and a second terminal;
- coupling a first module to the first terminal of the capacitor;
- and
- coupling a second module to the second terminal of the capacitor.
Dependencies are inferred from the claim text.