Cooling system for electronics with improved thermal interface
AssigneeThermal Corp.
InventorsDavid B. Sarraf, Robert E. DeHoff, John Hartenstine, John J. Todd JR.
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Abstract
A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.
Claims29
A heat pipe system comprising:
- a heat transfer block;
- and,
- a heat pipe coupled to the heat transfer block by a clip.
A computer comprising:
- at least one electronic component;
- a heat transfer block disposed adjacent to the at least one electronic component;
- and,
- a heat pipe coupled to the heat transfer block by a clip.
A method for cooling a heat-producing element, comprising the steps of:
- disposing a heat transfer block adjacent the heat-producing element;
- coupling the heat transfer block to a heat pipe using a clip.
A method for manufacturing a heat pipe assembly, comprising the steps of:
- forming a heat transfer block with at least one heat pipe channel and at least one clip channel disposed therein;
- bonding a heat pipe to the heat pipe channel;
- and
- bonding a clip to the at least one clip channel, such that the clip overlies at least a portion of the heat pipe.
Dependencies are inferred from the claim text.