Multiple chip stack structure and cooling system
AssigneeMicron Technology, Inc.
InventorsPaul A. Farrar, Jerome M. Eldridge
Life of this patent
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Abstract
An electronic package comprised of multiple chip stacks attached together to form a single, compact electronic module. The module is hermetically sealed in an enclosure. The enclosure comprises a pressurized, thermally conductive fluid, which is utilized for cooling the enclosed chip stack. A structure that allows for densely-packed, multiple chip stack electronic packages to be manufactured with improved heat dissipation efficiency, thus improving the performance and reliability of the multi-chip electronic packages.
Claims13
A method of forming an electronic packaging module, comprising:
- securing a first plurality of integrated circuit chips in a first chip stack, wherein the first chip stack comprises a first lateral face wherein the first lateral face comprises a portion of each chip;
- securing a second plurality of integrated circuit chips in a second chip stack, wherein the second chip stack comprises a first lateral face wherein the first lateral face comprises a portion of each chip;
- bonding the first lateral face of the first chip stack to the first lateral face of the second chip stack so as to form a single module;
- electrically interconnecting the module to a bonding substrate, wherein the bonding substrate comprises external circuitry.
A method of forming an electronic packaging module, comprising:
- securing a plurality of integrated circuit chips so as to form a chip stick;
- enclosing the chip stack inside an enclosure;
- introducing a thermally conductive fluid to the enclosure, the thermally conductive fluid has a thermal conductivity greater than that of air at one atmosphere, wherein the thermally conductive fluid contacts the chip stack and transfers heat therefrom.
Dependencies are inferred from the claim text.