Exposure apparatus and method of manufacturing a semiconductor device using the same
AssigneeCanon Kabushiki Kaisha
InventorHiromichi Hara
Life of this patent
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Abstract
In an exposure apparatus having a structure which is supported by a vibration isolating mechanism, and a partition wall which is inserted in at least part of the optical path of exposure light used in the exposure apparatus, the structure and partition wall are coupled by an elastic seal member to form a closed space, and the interior of the partition wall is partitioned from the remaining space.
Claims14
An exposure apparatus which transfers a mask pattern onto a substrate via a projection optical system, comprising:
- a structure which is supported by a vibration isolating mechanism;
- and
- a partition wall which is inserted in at least part of an optical path of exposure light used in the exposure apparatus,
- wherein said structure and said partition wall are coupled by an elastic seal member to form a closed space, and an interior of the partition wall is partitioned from a remaining space.
A semiconductor device manufacturing method of manufacturing a semiconductor device by using an exposure apparatus which transfers a mask pattern onto a substrate via a projection optical system, comprising:
- a coating step of coating the substrate with a photosensitive agent;
- an exposure step of exposing the substrate by the exposure apparatus;
- and
- a step of developing the exposed substrate,
- wherein the exposure apparatus includes
- a structure which is supported by a vibration isolating mechanism, and
- a partition wall which is inserted in at least part of an optical path of exposure light used in the exposure apparatus,
- the structure and the partition wall are coupled by an elastic seal member to form a closed space, and
- an interior of the partition wall is partitioned from a remaining space.
Dependencies are inferred from the claim text.