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US 2004/0056280 A1Published application
Semiconductor device and a method of manufacturing the same
AssigneeHitachi, Ltd.
InventorsTomoo Murata, Shinobu Yabuki, Takeo Yamashita
Life of this patent
Estimating the term…
Abstract
In a method of manufacturing a semiconductor device comprising: having a first wiring extending in a first direction; and a second wiring connected to the first wiring through a connection and extending in a second direction orthogonal to the first direction, the second wiring having a surplus portion projecting from the connection in a direction opposite to the second direction, the first and second wirings are arranged such that a center of the connection is offset in the second direction from a center of the first wiring, and a projecting portion of the first wiring is disposed under the connection.
Claims39
A method of manufacturing a semiconductor device comprising:
- (a) a first wiring extending in a first direction;
- and
- (b) a second wiring connected to the first wiring through a connection and extending in a second direction orthogonal to the first direction, the second wiring having a surplus portion projecting from the connection in a direction opposite to the second direction,
- wherein the first wiring and the second wiring are arrange such that,
- (c) a center of the connection is offset in the second direction from a center of the first wiring, and
- (d) a projecting portion of the first wiring is disposed under the connection.
3 more elements
A method of manufacturing a semiconductor device, comprising:
- (a) a first wiring and a second wiring extending in a first direction and adjacent to each other;
- (b) a third wiring connected to the first wiring through a first connection and extending in a direction opposite to the second wiring and along a line orthogonal to the first direction, the third wiring having a first surplus portion projecting in the direction of the second wiring from the first connection;
- and
- (c) a fourth wiring connected to the second wiring through a second connection and extending along said line in a direction opposite to the first wiring, the fourth wiring having a second surplus portion projecting in the direction of the first wiring from the second connection,
- wherein the first, second, third, and fourth wirings are arranged such that,
- (d) a center of the second connection is offset in a direction opposite to the first wiring from a center of the second wiring, and
- (e) a projecting portion of the second wiring is disposed under the second connection.
4 more elements
A method of manufacturing a semiconductor device, comprising the steps of:
- (a) disposing a first wiring and a second wiring extending in a first direction and being adjacent to each other;
- (b) disposing a third wiring being connected to the first wiring through a first connection and extending in a second direction orthogonal to the first direction and in opposition to the second wiring, the third wiring having a first surplus portion projecting in the direction of the second wiring from the first connection;
- (c) disposing a fourth wiring being connected to the second wiring through a second connection and extending in the second direction and in opposition to the first wiring, the fourth wiring having a second surplus portion projecting in the direction of the first wiring from the second connection;
- (d) determining whether the third and the fourth wiring are positioned on one and same line and whether the distance between the first and the second surplus portions is a predetermined distance or less;
- (e) if the distance between the first and the second surplus portions is the predetermined distance or less,
- (f) displacing a center of the second connection from a center of the second wiring in a direction opposite to the first wiring;
- and
- (g) disposing a projecting portion of the second wiring under the second connection.
5 more elements
The method according to claim 16, wherein the distance between the third and the fifth wirings is smaller than the distance between the first and the second wirings.
A method of manufacturing a semiconductor device, comprising the steps of:
- disposing:
- (a) a first wiring extending in a first direction;
- (b) a connection on the first wiring;
- and
- (c) a terminal on the connection extending in a second direction orthogonal to the first direction and having a surplus portion, the surplus portion projecting from the connection in a direction opposite to the second direction, and
- (d) disposing a second wiring in the second direction from the terminal.
3 more elements
A method of manufacturing a semiconductor device, comprising the steps of:
- (a) defining a first layout line of a first wiring layer extending in a first direction and a second layout line of a second wiring layer extending in a second direction orthogonal to the first direction;
- (b) disposing virtually a first wiring along the first layout line, the first wiring having projecting portions respectively on both sides of an intersecting point of the first and the second layout lines;
- (c) disposing a second wiring along the second layout line;
- (d) disposing a connection in an overlapped region of patterns of the first and the second wirings;
- and
- (e) defining a pattern of the first wiring with the projecting portions of the first wiring disposed only under the connection.
3 more elements
A semiconductor device comprising:
- (a) a first wiring extending in a first direction;
- and
- (b) a second wiring connected to the first wiring through a connection and extending in a second direction orthogonal to the first direction, the second wiring having a surplus portion projecting in a direction opposite to the second direction,
- (c) the connection being formed so that a center thereof is offset in the second direction from a center of the first wiring, and
- (d) the first wiring having a projecting portion formed under the connection.
2 more elements
A semiconductor device comprising:
- (a) a first wiring and a second wiring extending in a first direction and being adjacent to each other;
- (b) a third wiring being connected to the first wiring through a first connection and extending in a second direction orthogonal to the first direction and in opposition to the second wiring, the third wiring having a first surplus portion projecting in the direction of the second wiring from the first connection;
- and
- (c) a fourth wiring being connected to the second wiring through a second connection and extending in the second direction and in opposition to the first wiring, the fourth wiring having a second surplus portion projecting in the direction of the first wiring from the second connection;
- (d) the second connection being formed so that a center thereof is offset from a center of the second wiring in a direction opposite to the first wiring, and
- (e) the second wiring having a projecting portion formed under the second connection.
3 more elements
A semiconductor device comprising:
- (a) a first wiring extending in a first direction and having at least one projecting portion;
- and
- (b) a second wiring connected to the first wiring through a first connection and extending from the first connection in a second direction orthogonal to the first direction, the second wiring having a first surplus portion projecting from the first connection in a direction opposite to the second direction,
- the first connection being formed on the first wiring and the projecting portion thereof.
1 more element
A semiconductor device comprising:
- (a) a first wiring extending in a first direction and having at least one projecting portion;
- (b) a second wiring connected to the first wiring through a first connection and extending from the first connection in a second direction orthogonal to the first direction, the second wiring having a first surplus portion projecting from the first connection in a direction opposite to the second direction;
- and
- (c) a third wiring connected to the first wiring through a second connection and extending from the second connection in a second direction orthogonal to the first direction, the third wiring having a second surplus portion projecting from the second connection in a direction opposite to the second direction,
- the first connection being formed on the first wiring, and the second connection being formed on the first wiring and the projecting portion thereof.
2 more elements
Dependencies are inferred from the claim text.