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AssigneeHitachi High-Technologies Corporation
InventorsSeiichiro Kanno, Ken Yoshioka, Ryoji Nishio, Saburou Kanai, Hideki Kihara, Koji Okuda
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A wafer stage for use in a wafer processing apparatus having a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto the liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck. The wafer stage enables performance of wafer processing while letting a wafer be mounted on the ceramic plate. The liquid cooling jacket enables attachment of the ceramic plate through a gap for circulation of a coolant gas as formed over the liquid cooling jacket, and a heat resistant seal material containing therein an elastic body for sealing the coolant gas between the liquid cooling jacket and the ceramic plate.
A wafer stage for use in a wafer processing apparatus comprising a liquid cooling jacket with a built-in coolant liquid circulation path and a ceramic plate as attached onto said liquid cooling jacket and having therein a heater and an electrode for an electrostatic chuck, said wafer stage being enabling performance of wafer processing while letting a wafer be mounted on the ceramic plate, wherein said liquid cooling jacket enables attachment of said ceramic plate through a gap for circulation of a coolant gas as formed over said liquid cooling jacket, and a heat resistant seal material containing therein an elastic body for sealing said coolant gas between said liquid cooling jacket and said ceramic plate.
Dependencies are inferred from the claim text.