Process and system to package residual quantities of wafer level packages

A method of loading a tape and reel containment system with semiconductor devices, comprising:

• (a) picking semiconductor devices from a containment system other than tacky film;
• (b) transferring said devices picked in (a) to a tape and reel;
• (c) then, selecting good devices from a wafer in accordance with a previously generated map;
• and
• (d) transferring said good devices selected from the wafer in (c) to said tape and reel.

A method of separating good semiconductor devices from bad semiconductor devices formed from a wafer on tacky film, comprising:

• identifying each bad device using a good/bad map;
• removing all bad devices from said tacky film;
• and
• after removing all bad devices, then removing good devices from said tacky film for placement in a chip containment system.

A method of separating good semiconductor devices from bad semiconductor devices formed from a wafer placed in a transfer machine, comprising:

• (a) aligning said wafer;
• (b) identifying and picking good devices from said wafer using a good/bad map without picking any devices involved in aligning said wafer;
• and
• (c) updating said map to reflect the good devices that have been removed from said wafer.

A semiconductor transfer machine, comprising:

• a plurality of stations, at least three of said stations accommodating a different type of chip containment medium;
• a turntable rotatably accessible to each of said plurality of stations, said turn table comprising a plurality of pockets into which chips are placed to transfer said chips from one station to another;
• and
• a plurality of pick and place tools accessible by said turn table and said stations, one pick and place tool located at each station and capable of transferring a chip between its corresponding station and a pocket on said turn table.