Electronic device package
AssigneeMicron Technology, Inc.
InventorsWalter L. Moden, Todd O. Bolken
Life of this patent
Estimating the term…
Abstract
A packaged assembly including an interposer or substrate supporting on a first side thereof a chip that is encased with an encapsulant is described. A second side of the interposer or substrate includes a barrier that blocks the flow of encapsulant to create a uniform encapsulant edge on the second side of the interposer. The uniform edge helps prevent flaking of the encapsulant off the interposer. The packaged assembly is adapted to be used with a further electronic device to expand the capablilities of the further electronic device.
Claims56
An assembly, comprising:
- an interposer having a first side and a second side;
- an electrical device connected to the first side of the interposer;
- a covering encasing the electrical device;
- and
- a barrier on the second side of the interposer, wherein the barrier stops bleeding of the covering on the second side of the interposer.
An assembly, comprising:
- an interposer having a first side, a second side, and an edge extending between the first side and the second side;
- an electrical device connected to the first side of the interposer;
- and
- a covering encasing the electrical device and extending around the edge onto the second side, the covering having a substantially linear edge on the second side.
An overmolded package, comprising:
- a substrate including a first side, a second side, and an edge extending between the first side and the second side;
- an electrical device connected to the first side;
- an electrically insulating covering encasing the electrical device and extending over the edge onto the second side;
- and
- a barrier on the second side containing bleeding of the covering.
An overmolded package, comprising:
- a substrate having a first side and a second side;
- an electrical device connected to the first side of the substrate;
- a covering encasing the electrical device;
- and
- means for containing bleeding of the covering on the second side.
An apparatus, comprising:
- a substrate including a first side, a second side, and an edge extending between the first side and the second side;
- an electrical device connected to the first side;
- a soldermask on the second side;
- and
- a covering encasing the electrical device and abutting the soldermask.
A portable electronic device, comprising:
- a user interface;
- and
- an electronic component operably connected to the user interface, wherein the electronic component includes:
- an interposer having a first side and a second side an electrical device connected to the first side of the interposer;
- a covering encasing the electrical device;
- and
- a barrier on the second side of the interposer, wherein the barrier stops bleeding of the covering on the second side of the interposer.
A portable electronic device, comprising:
- a case;
- and
- circuitry in the case, wherein the circuitry includes:
- a substrate including a first side, a second side, and an edge extending between the first side and the second side;
- an electronic component connected to the first side;
- a barrier on the second side;
- and
- a covering encasing the electronic component, extending around the edge and abutting the barrier.
A process for encapsulating integrated circuits on an interposer, comprising:
- defining an encapsulation chamber about an integrated circuit die and an interposer;
- filling the chamber with an encapsulant;
- controlling outflow of the encapsulant from the chamber by providing an upstanding barrier proximate to an edge of the interposer.
Dependencies are inferred from the claim text.